In the copper foil industry, it is currently relatively […]
In the copper foil industry, it is currently relatively backward overall. Japan has strong technology in the copper foil industry. Companies such as Mitsui Metals, Japan Energy, Furukawa Electric, and Fukuda Metals have large scale and output, accounting for global production. 50% of the market share in China has also reached about 40%. Its main technical features are advanced surface treatment technology, a certain history of research, and a solid foundation.
Such as Japan's Fujiwara Kazuhisa, Den Bosch and other inventions of the surface treatment technology of chemical and heat resistance and ion mobility, that is, based on the roughening of the first galvanized nickel alloy layer, in the galvanized tin alloy layer, and after chromate blunt Treatments and coating with silane coupling agents after heat treatment at 80-260°C can be used in automotive electronics.
The two-sided copper foil surface treatment non-blackening technology invented by Toda Kazuya and Tomoya Kumaga, etc., is to apply copper and nickel brass plating on any side of the roughened and roughened rolled copper foil and then passed through the chromate. Passivation, and with different types and concentrations of silane coupling agent to deal with, to avoid the black oxide formed on the inner layer copper foil after the traditional blackening treatment is easy to react with the subsequent pore metallization process liquid, forming a void, so that the circuit board Insulation performance and reliability between layers can be reduced.
Japan Suzuki Zhaoli, Fukuda Shih, and others invented a fine copper foil manufacturing method that can be used for high-density fine lines, can produce 3μm, 5μm ultra-thin copper foil, customarily called carrier copper foil, the specific method is to use A 12-70 μm electrolytic copper foil, rolled copper foil or aluminum foil is used as a carrier, and then the carrier is plated with a peeling layer, a diffusion layer, and a copper layer, and the copper plating layer is pressed against the insulating substrate, and then the carrier copper foil is peeled off. Copper clad laminates made from ultra-thin copper foil can be obtained.